
La tablette durcie M1 équipée de la caméra Intel® RealSense™ D410 est idéale pour effectuer des mesures 3D avec précision. Elle est adaptée à une vaste palette d’applications industrielles telles que l’optimisation de l’espace dans les entrepôts et la gestion de chaîne logistique. C’est également la solution idéale pour la surveillance de plaies dans le secteur médical, la maintenance d’usines et d’équipements ou encore la documentation de sinistre pour l’assurance. Panasonic a intégré cette technologie dans une option prévue pour son produit phare, le TOUGHBOOK M1, permettant aux utilisateurs de capturer les données en 3D tout en utilisant le même terminal pour faire tourner les applications dont ils ont besoin dans le cadre de leur travail.
Technologie
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Please see below the services available for this product. You can also use this section to access the general Service & Downloads area of the website or contact our Technical Support team.
SERVICES & TÉLÉCHARGEMENTS CONTACTER LE SUPPORT TECHNIQUEPlease see below the services available for this product. You can also use this section to access the general Service & Downloads area of the website or contact our Technical Support team.
SERVICES & TÉLÉCHARGEMENTS CONTACTER LE SUPPORT TECHNIQUEThere are currently no key services available.
Please see below the services available for this product. You can also use this section to access the general Service & Downloads area of the website or contact our Technical Support team.
SERVICES & TÉLÉCHARGEMENTS CONTACTER LE SUPPORT TECHNIQUEThere are currently no other services available.
Caractéristiques Techniques Complètes
Mobile Computing Platform | Intel® Core™ i5-7Y57 vPro™ Processor |
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Operating System | Windows 10 Pro |
RAM | 4GB RAM (max. 8GB) |
Graphic Chip | Intel® HD Graphics 615 |
Storage | 128GB SSD (256GB optional) |
LCD | 7" Active Matrix (TFT) colour LCD 1280 x 800 (WXGA) LCD with sunlight-viewable glove-enabled capacitive touchscreen (up to 700cd/m²) |
Intel® RealSense™ 3D Camera D410 | Reading Distance: 0.16 meters up to 10 meters (varies depending on performance accuracy, scene and light conditions) Accuracy: Accuracy varies depending on target, environmental condition and on application implementation User Environment: Indoor/Outdoor Image Sensor Technology: Rolling Shutter; 1.4um x 1.4 um pixel size Depth Field of View (FOV) (Horizontal x Vertical) for HD 16:9: 63.4° x 40.4° (+/- 3°) Depth Frame Rate: Up to 90fps Color Resolution: Up to 1280x720 |
Bluetooth™ | 4.2 + EDR Class 1 |
Wireless LAN | Intel® Dual Band Wireless-AC 8265 |
Mobile Broadband* | 4G LTE, supports 3G |
GPS* | U-Blox NEO-M8N |
Sound | WAVE and MIDI playback, Intel® High Definition Audio subsystem support, internal Microphone for Webcam |
Security | TPM (TCG V2.0 compliant) Password security (supervisor password, user password, hard disc lock) Integrated hardware security lock slot |
Front Camera | 2mpixel |
Rear Camera | 8mpixel with autofocus and LED flash |
Micro SD/SDXC Memory Card | x1 |
USB 3.0 | x1 |
Headset | x1 |
DC In | x1 |
Port Replicator | x1 |
Dual Antenna Connector* | x1 |
Configuration port** | LAN, Serial, 2D Barcode Reader, USB 2.0 |
Business Expansion Module** | NFC, Smartcard Reader, Thermal by FLIR, Hot Swap |
AC Adapter | Input: 100V - 240V AC, 50Hz/60Hz, Output: 16V DC, 3.75A |
Battery | Lithium-Ion (2 cell, 23 Whr) |
Battery Life | Approx. 8 hours (Mobile Mark™ 2014), Approx. 18 hours with 4 cell battery* |
Power Management | Hot swap*, Standby function, ACPI BIOS |
Dimensions (WxHxD) | 203mm x 18mm x 132mm / 7.98" x 5.20" x 0.71" |
Weight | Approx. 540g / 1.2lb |
Drop Resistance | MIL-STD 810G, 180cm*** |
Dust Resistance | IEC529 (JIS C0920) IP6x*** |
Water Resistance | IEC529 (JIS C0920) IPx5*** |
Operating Temperature | MIL-STD 810G, -29 °C to 60 °C *** |
Standard Configuration | FZ-M1mk3 RealSense Model, 4GB RAM, 128GB SSD, Battery Pack, Stylus Pen |
Included in the box | Power Supply, Power Cord, Display cleaning cloth and User Manual |
Footnote | *Optional **One option exlusive possible in configuration port / business expansion module ***Tested by an independent third party lab following MIL-STD-810G and IEC 60529, Sections 13.4, 13.6.2, 14.2.5 and 14.3 |
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